Broadcom combines HSUPA and low power for smartphone push
Published: 8 February, 2010
READ MORE: Broadcom | Semiconductor | Android
Broadcom has tried for some years to break into the cellphone system-on-chip market, but has made limited impact so far. Its breakthrough moment came when it was placed on Nokia's supplier list, initially for EDGE chips and later for low cost HSPA devices. However, its latest HSPA design claims to be optimized for Android and Windows Mobile, suggesting the chip firm may be looking beyond Nokia.
Although Broadcom's low power, low cost credentials attracted Nokia, it seems the market leader's actual uptake of Broadcom's 3G chips has been disappointing. The Finnish giant has spread its smartphone favors widely -ST-Ericsson is in pole position; Qualcomm will be in one or more US launches planned in 2010; and Texas Instruments supplies the OMAP apps processor and some customized basebands. And Intel, whose Atom powers the Booklet 3G, could also turn up in some mobile internet devices, following a far reaching alliance announced last year.
So Broadcom is targeting the growing Android OEM base, with WinMo included on its priority list too, HTC must be in its sights. It is a member of the Open Handset Alliance, which supports Android, and has worked closely with the OS.
The US firm says its BCM21553 processor is the first to combine 5.8Mbps HSPA uplink with built-in graphics processing. Based on an ARM11 processor, the chip supports video support up to HVGA quality and an 8-megapixel camera, as well as 7.2Mbps downlink.
Jim Tran, general manager of Broadcom's mobile communications division, said in a statement: "We are established as a reliable supplier of baseband and other mobile technologies for popular new smartphone and advanced smart featurephone devices. With the introduction of our new BCM21553 HSUPA baseband processor and BCM2091 RF transceiver solutions, we are now enabling a new generation of increasingly affordable handsets."
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